SAT Batch Spray Acid Technology

OEM Group Spray Batch

SAT Batch Spray Introduction

Leveraging an innovative enhanced spray technology OEM Group’s SAT offers wet-chemical processing to meet most any application demand. The SAT processes multiple wafer sizes with one carrier change.  With the smallest footprint (12 sq ft) among similar equipment, the SAT not only saves fab-floor real estate, it also enables high up-time and low CoO.

Applications:

  • Metal etch, Oxide etch, GaAS etch (recess etch)
  • UBM etch, Cu etch, Cu rework
  • Polymer removal, photo-resist strip

Specifications:

  • B&R Industrial PLC, motor controller and PC
  • Pilz programmable EMO circuit
  • Rotary encoder for RPM monitoring and control
  • SMC solenoids via bus-interface
  • Eddysonic Vortex flow meter for standard applications
  • Process-critical items manufactured by OEM Group to ensure integrity

Features and Benefits

  • 25- and 50- wafer batch process – high throughput and semi-automated
  • Reduced drag out and chemical & DI water consumption mean low cost of ownership
  • Flexible chemical configurations – up to 4 chemical tanks
  • Components are universal across all spray batch platforms
  • Modular construction and service-friendly design, replaces large wet benches by 1/10th of required footprint
  • SAT can be configured with up to four onboard chemical tanks, external support of chemical delivery units (CDUs), external O3 generators for
  • Ozone processes and 25- or 50-wafer process loads

EST Enhanced Spray Technology:

  • Delivers process improvement through uniform media flow
  • Nozzle-per-wafer concept ensures:
    • Uniform flow
    • Increased rinse efficiency

Other OEM Group Spray Batch Models

SST Batch Spray Solvent Tool

Spray Solvent Tool

SOT Batch Spray Ozone Tool

Spray Ozone Tool