Cintillio S CPT

Cintillio S CPT

The Cintillio Sis a state-of-the-art Automated batch wafer surface preparation platform featuring high throughput and precise process control. The Cintillio S platform provides solutions for FEOL and BEOL manufacturing, as well as wafer scale packaging.

Process Applications

Solvent

  • Resist Strip
  • Resist De-scum
  • Polymer removal
  • High Density Implant Resist Strip

Acid

  • Prediffusion clean
  • Post-ash  clean, Post-CMP clean
  • ONO etch, UBM etch, Metal etch
  • Polymer removal
  • Photoresist strip
  • Wafer reclaim

Cintillio S

  • Prediffusion clean, Critical clean
  • Post-ash clean, Post-CMP clean
  • ONO etch
  • Polymer removal
  • Photoresist strip
  • Ozone Processing
  • Wafer reclaim

Features

  • Automated Dry in – Dry out
  • Multiple processes in one sequence
  • No sorter required
  • Repeatable process control
  • Guardian Carrier Technology
  • Up to 400wph throughput
  • 50mm to 300mm wafer processing
  • Acid, Bases, Solvent and Ozone processing
  • SMIF, FOUP and Cassette compatible

Benefits

  • High productivity
  • Flexibiilty
  • Robust automation
  • Advanced process control