The HF Vapor platform delivers the OEM Group patented HF Vapor process. The on-axis, HDPE, process chamber can accommodate up to 25 wafers in a vertical orientation.

Process Applications:

• Spring Release
• Selective oxide etch
• Hydrophobic termination

Features:

• HDPE process chamber
• Atmospheric process
• MFC control
• Up to 25-wafer loads
• No DIW used in the process

Benefits:

• No “memory” effect
• Simple facilities
• Precise, flexible process control
• High throughput
• Stiction free process