The HF Vapor platform delivers the OEM Group patented HF Vapor process. The on-axis, HDPE, process chamber can accommodate up to 25 wafers in a vertical orientation.
Process Applications:
- Spring Release
- Selective oxide etch
- Hydrophobic termination
Features:
- HDPE process chamber
- Atmospheric process
- MFC control
- Up to 25-wafer loads
- No DIW used in the process
Benefits:
- No “memory” effect
- Simple facilities
- Precise, flexible process control
- High throughput
- Stiction free process