Endeavor MX PVD

SFI Endeavor

piezoelectric thin films for
FBAR, SMR, and PiezoMEMs

Highly oriented AlN films without heating and biasing
High quality ScAlN deposition
Full-face deposition
6 process module capability
Simple size conversion from 150mm to 200mm
Independent stress control

high density plasma source for
advanced metal etch applications

Pt, Au, Ir, Pd and Ru electrode etch
High selectivity etch for PZT stopping on Pt
Uneffected by sensitivity to conductive metal deposits
Independent control of ion density and ion energy
Low pressure low temp process capability
Enhanced plasma density at low pressure

Other Endeavor Models

Endeavor EUV PVD

Endeavor EUV PVD

Endeavor AT PVD

Endeavor AT