Endeavor AT Wafer Size: 100mm – 200mm
The Endeavor AT cluster tool is a state-of-the-art platform for traditional and reactive thin film sputtering of a wide range of materials used in the microelectronics industry. The heart of the system is the patented dual-cathode S-Gun magnetron sputtering source. Designed to give the engineer very tight control over a wide range of process parameters, it produces high purity, dense films with excellent uniformity, and low stress. Featured applications include under bump and back side metallization, ultra-dense silicon nitride encapsulation, resistor films with controllable TCR, and highly oriented aluminum nitride for FBAR devices. The Endeavor AT is the premiere PVD system for metallization of ultra-thin silicon wafers used for the most advanced IGBT power devices.