AGHeatpulse 8108 RTP

AG Associates

AGHeatpulse 8108 RTP Introduction

The AGHeatpulse 8108 is a low cost RTP solution for advanced processing of substrate up to 200mm. The small footprint, cassette-to-cassette system can be configured to process standard silicon wafers or exotic compound semiconductor substrates in a susceptor. Originally introduced by AG Associates, the AGHeatpulse 8108 is an exclusive product of OEM Group, the exclusive OEM-licensed manufacturer of the AGHeatpulse 8108.

Superior Process Control—Improved Yield

  • Single wafer, closed-loop temperature control
  • Automatic susceptor loading configuration for exotic substrate processing

Advanced Temperature Measurement and Control

  • Pyrometer or optional ez-DTC temperature control with redundant backup to prevent misprocessing
  • Emissivity independent control with optional ceramic shield

Upgrade Ability for Extended Capital Use

  • Performance and throughput upgrades to deliver AGHeatpulse 8800 capabilities

Integrated Applications

  • Silicon, GaAs, and compound substrates
  • Implant activation & anneal
  • Thermal oxidation / nitridation
  • Metal silicidation (Ti, Co, Ni)
  • Low-K dielectric anneal
  • Gate anneal
  • Glass flow / reflow
  • SOG densification

AGHeatpulse 8108 RTP

AGHeatpulse 8108 Upgrades

eZ-DTC Control

ez-DTC Probe

in-Situ Oxygen Monitor

O2 Analyzer

8108 Nitrogen Curtain

N2 Curtain Upgrade