Mattson™ Aspen II Ash

Aspen II Ash consists of the standard Aspen platform together with one or two processing chambers. Each chamber processes two wafers at a time. System throughput varies with the resist thickness and is approximately 60-120 wafers per hour with one chamber and 110-160 wafers per hour with two chambers for most applications.

The two-chamber Aspen Ash offers a substantial reduction in CoO relative to conventional single wafer systems. Systems achieve substantial improvements in throughput which result in a substantial reduction in CoO and allow users to reduce both wet chemical steps and the number of needed systems.

Applications
• Diode
• Triode
• ICP
• ICP-sm
• ICP Lite Etch