The Upgraded Heated Wafer Paddle, developed by the OEM Group includes an array of upgrades from the Original. An enhanced wire heating element design and mechanically fixed thermocouple provides immediate and measurable uniformity improvement, while the dual-sided anodization and optimized planarization reduce deformity and increase lifecycle longevity. The paddle is a drop-in replacement assembly.

Applicable systems/Platforms
• Lam TCP 9600
• Lam Rainbow

Features:
• Embedded wire heating element
• Dual-sided anodization
• Mechanically fixed TC
• Optimized planarization

Advantages:
• Improved heating uniformity
• Increased longevity of > 1 year
• Reduced paddle deformity

Benefits:
• Drop-in replacement
• Improved thermal profile
• ReNEWable design for low CoO