The Novellus Concept Two Platform is a modular system capable of both dielectric deposition and conductive metal layers. Each process chamber is capable of processing multiple wafers. The modular configuration of the Concept Two provides flexibility to the customer by offering a variety of configurations depending on process requirement.

Concept Two Sequel: This Dielectric CVD process module provides high throughput deposition of thick films and dual layer passivation films.

Concept Two Speed: The Speed process module is used for customers needing a high throughput solution to their dielectric gap fill requirements.

Concept Two Altus: The Altus process module is the Tungsten CVD solution for plug fill and low-stress composite interconnects.